may 2011 doc id 018522 rev 2 1/10 10 ESDAXLC4-1BF3 single line extra low capacitance tvs features stand-off voltage 3 v ultra low capacitance 0.3 pf on a wide frequency spectrum, 200 to 3000 mhz bidirectional device low clamping factor v cl /v br fast response time very thin package: 0.36 mm max low leakage current complies with the following standards iec 61000-4-2 level 4 applications where transient over voltage protection and electrical overstress protection in sensitive equipment is required, such as: computers printers communication systems cellular phone handsets and accessories video equipment portable equipment description the ESDAXLC4-1BF3 is a single line transil? diode designed specifically for the protection of integrated circuits into portable equipment and miniaturized electronics devices subject to esd and eos transient over voltages. packaged in wlcsp, it minimizes pcb consumption. figure 1. schematic diagram (top view) tm : transil is a trademark of stmicroelectronics flip chip (2 bumps) www.st.com
characteristics ESDAXLC4-1BF3 2/10 doc id 018522 rev 2 1 characteristics figure 2. electrical characteristics (definitions) table 1. absolute maximum ratings (t amb = 25 c) symbol parameter value unit v pp peak pulse voltage: iec61000-4-2 contact discharge 8 kv p pp peak pulse power dissipation (8/20 s) (1) t j initial = t amb 55 w i pp repetitive peak pulse current (8/20 s) t j initial = t amb 3a t j junction temperature - 55 to +125 c t stg storage temperature range - 65 to +150 c t l maximum lead temperature for soldering during 10 s 260 c 1. for a surge greater than the maximum val ues, the diode will fail in short-circuit symbol parameter v rm stand-off voltage v br breakdown voltage v cl clamping voltage i rm leakage current @ v rm c line line capacitance table 2. electrical characteristics (values, t amb = 25 c) symbol test condition min. typ. max. unit v br i r = 1 ma 4 5.5 - v i rm v rm = 3 v --50na v cl i pp (8/20 s) = 1 a - - 10 v c line f = [200 mhz -3000] mhz, v r = 0 v dc, v osc = 30 m v rms -0.30.4pf
ESDAXLC4-1BF3 characteristics doc id 018522 rev 2 3/10 figure 3. junction capacitance versus reverse applied voltage (typical values) figure 4. junction capacitance versus frequencies (typical values) 0 200 400 600 800 1000 1200 01234 5 f=1 mhz v = 30 mv v = 0v t = 25 c osc rms r j c(pf) v (v) r 0 100 200 300 400 0 500 1000 1500 2000 2500 3000 c(pf) f(mhz) f = 20 mhz ?3 ghz v = 30 mv v= 0v t = 25 c osc rms r j figure 5. s 21 attenuation measurement result figure 6. variation of leakage current versus junction temperature (typical values) 0 1 100 25 50 75 100 125 150 v=v = 3v rrm t (c) j i (na) r figure 7. esd response to iec61000-4-2 (+8 kv contact discharge) figure 8. esd response to iec61000-4-2 (-8 kv contact discharge) c2 50 v/div 20 ns/div c2 20 ns/div 50 v/div
ordering information scheme ESDAXLC4-1BF3 4/10 doc id 018522 rev 2 2 ordering information scheme figure 9. ordering information scheme esda xlc 4 - 1 b f3 esd array extra low capacitance breakdown voltage number of lines type package 14v2 = 14.2 volt min. 1 = 1 line b = bi-directional f = flip chip x = 3: lead-free, pitch = 400 m, bump height = 255 m
ESDAXLC4-1BF3 package information doc id 018522 rev 2 5/10 3 package information epoxy meets ul94,v0 lead-free package in order to meet environmental requirements, st offers these devices in different grades of ecopack ? packages, depending on their level of environmental compliance. ecopack ? specifications, grade definitions and product status are available at: www.st.com . ecopack ? is an st trademark. figure 10. package dimensions figure 11. marking 0.36 mm 45 m 0.69 mm 30 m 0.50 mm 30 m 0.40 mm 40 m 0.37 mm 15 m x
pcb recommendations ESDAXLC4-1BF3 6/10 doc id 018522 rev 2 figure 12. flip chip tape and reel specification 4 pcb recommendations 4.1 design for optimum electrical performance and high ly reliable solder joints, stmicroelectronics recommends the pcb design recommendations listed in ta b l e 3 . note: a gold layer finishing on the pcb pad that is too thick (0.2 m maximum) is not recommended (low joint reliability). user direction of unreeling all dimensions in mm 4.0 0.1 2.0 0.05 8.0 0.3 2.0 0.1 1.75 0.1 3.5 - 0.05 ? 1.55 0.05 0.43 0.1 0.57 0.05 0.20 0.05 0.75 0.05 table 3. pcb design recommendations for solder bar pitch 400 m for nsmd pcb non solder mask defined oblong pad: 370 x 180 m ? micro via ssbu allowed ? micro via sbu to be avoided ? micro via sbu filled (under qualification) tr a c k : ? only one track per pad ? maximum track width = 100 m track layout must be symmetrical to the die axis (to homogenize stress and welding attraction during reflow assembly) for smd pcb solder mask defined oblong pad: ? micro via ssbu allowed ? micro via sbu to be avoided ? micro via sbu filled (under qualification) pcb pad finishing cu ? ni (2-6 m) - au (0.2 m max)
ESDAXLC4-1BF3 pcb recommendations doc id 018522 rev 2 7/10 to optimize the natural self centering effect of csp on the pcb, pcb pad positioning and size have to be properly designed (see figure 13 ) micro vias an alternative to routing on the top surface is to route out on buried layers. to achieve this, the pads are connected to the lower layers us ing micro vias. only ssbu via technology is approved. figure 13. solder mask opening 370 m 370 m 100 m 450 m 180 m 180 m 255 m non solder mask defined solder mask defined
pcb recommendations ESDAXLC4-1BF3 8/10 doc id 018522 rev 2 4.2 assembly for chip scale package mounting on the pcb, stmicroelectronics recommends the use of a solder stencil aperture of 330 x 330 m2 maximum and a typical stencil thickness of 75 or 80 m. chip scale packages are fully compatible with the use of near eutectic 95.5 sn, 4 ag, 0.5 cu solder paste with no-clean flux. st's recommendations for chip scale package board mounting are illustrated on the so ldering reflow profile shown in figure 14 . figure 14. st ecopack? recommended soldering reflow profile for pcb mounting dwell time in the soldering zone (with temperature higher than 220 c) has to be kept as short as possible to prevent component and substrate damages. peak temperature must not exceed 260 c. controlled atmosphere (n2 or n2h2) is recommended during the whole reflow, especially above 150 c. chip scale packages are able to withstand three times the previous recommended reflow profile in order to be compatible with a double reflow when smds are mounted on both sides of the pcb and one additional repair. a maximum of three soldering reflows are allowed for these lead-free packages (with repair step included). the use of a no-clean flux is highly reco mmended to avoid any cleaning operation. to prevent any bump cracks, ultrasonic cleaning methods are not recommended. 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max 0 01234567 time (min) temperature (c) 2c/s recommended 6c/s max 220c 125 c 260c max 255c 180c 90 sec max 10-30 sec 90 to 150 sec 3c/s max
ESDAXLC4-1BF3 ordering information doc id 018522 rev 2 9/10 5 ordering information 6 revision history table 4. ordering information order code marking package weight base qty delivery mode ESDAXLC4-1BF3 l flip chip 0.37 mg 15 000 tape and reel 7? table 5. document revision history date revision changes 03-mar-2011 1 initial release. 12-may-2011 2 updated features, ta bl e 1 , figure 9 and figure 11.
ESDAXLC4-1BF3 10/10 doc id 018522 rev 2 please read carefully: information in this document is provided solely in connection with st products. stmicroelectronics nv and its subsidiaries (?st ?) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described he rein at any time, without notice. all st products are sold pursuant to st?s terms and conditions of sale. purchasers are solely responsible for the choice, selection and use of the st products and services described herein, and st as sumes no liability whatsoever relating to the choice, selection or use of the st products and services described herein. no license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted under this document. i f any part of this document refers to any third party products or services it shall not be deemed a license grant by st for the use of such third party products or services, or any intellectual property contained therein or considered as a warranty covering the use in any manner whatsoev er of such third party products or services or any intellectual property contained therein. unless otherwise set forth in st?s terms and conditions of sale st disclaims any express or implied warranty with respect to the use and/or sale of st products including without limitation implied warranties of merchantability, fitness for a parti cular purpose (and their equivalents under the laws of any jurisdiction), or infringement of any patent, copyright or other intellectual property right. unless expressly approved in writing by an authorized st representative, st products are not recommended, authorized or warranted for use in milita ry, air craft, space, life saving, or life sustaining applications, nor in products or systems where failure or malfunction may result in personal injury, death, or severe property or environmental damage. st products which are not specified as "automotive grade" may only be used in automotive applications at user?s own risk. resale of st products with provisions different from the statements and/or technical features set forth in this document shall immediately void any warranty granted by st for the st product or service described herein and shall not create or extend in any manner whatsoev er, any liability of st. st and the st logo are trademarks or registered trademarks of st in various countries. information in this document supersedes and replaces all information previously supplied. the st logo is a registered trademark of stmicroelectronics. all other names are the property of their respective owners. ? 2011 stmicroelectronics - all rights reserved stmicroelectronics group of companies australia - belgium - brazil - canada - china - czech republic - finland - france - germany - hong kong - india - israel - ital y - japan - malaysia - malta - morocco - philippines - singapore - spain - sweden - switzerland - united kingdom - united states of america www.st.com
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